HDI High TG 24 Multilayer Immerison Gold Inner 0.5oz Outer 1oz PCB Board

HDI High TG 24 multilayer immerison gold Inner 0.5oz outer 1oz PCB board Multilayer future development trend:1.High density2.Thin poly (high) level of3.Diversification multilayer structure4.High performance thin substrate of thin copper box5.Board high flatness and surface coating technology6.Multilayer flexible and rigid-flex multilayer v Fast PCB Fabrication for Samples and Mass Productionv Electronic Components Sourcing Servicesv PCBA Assembly Services:SMT,DIP,BGA...v Function Testv Stencil,Cable and Enclosure Assembly v Reverse engineering servicev Standard Packing and On time Delivery  Model Number:XCEPCB0011   Shipping port:ShenZhen/HongKong          Place of origin:GuangDong,China    Delivery Time:3-10 Working Days  Production capacity:FR4:2000000Sqms   High Frequency board:10000SqmsPrice Terms:FOBMinimum Order Quantity:1pcPayment terms:TT,Paypal,Western UnionCertification:CE,ROHS,FCC,ISO9008,SGS,ULMaterial:FR4Soldermask:GreenMolde Number:xcepcb0011Silkscreen:WhiteLayer:24Panel Size:75*105mmBoard Thickness:1.6mmPackage Details:Inner:Vacuum-packed     Bubble bag     With Foam Outer:Carton BoxMin Line Space:4MilMin Line Width:4MilMin Hole Size:12MilFinished Surface:ENIGSpecial requirement:Provide Slice reportProvide shipment reportFinished Copper:1ozDelivery Time：8 DaysXinchenger Electronics co.,Ltd established in 2002,we have commited ourselves to manufacturing various of hi-frequency microwave pcb and multi-layer board including fastest sample production. we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena so on and so forth.our company's sufficient stocks of hi-frequency pcb materials such as Rogers,TACONIC,Arlon,Isola,F4B,TP-2,FR-4 (dielectric rage:2.2-16) mainly used in the area of high technologies like communication device,Electronics,Aerospace,Military industry to meet our worldwide customers with high quality.furthermore,we also keen on helping customers shorten the period of production development and 24 hours of sample service is available. Since the day of company foundation we continuously enaged in researching special and high precision printed circuit boards with the strong production capability of 2 to 28 layers of highly precise impedence,multi-layer blind buried,multi-layer mix-compression,highTG, copper substrate,Ceramic substrate PCB.we emphasize the significance of traning program for every single staff in the company even grass-roots employees which becomes the most competitive factors to excel from others,our company have many experienced and professional teams from management to production line,30% are highly educated among the total amount of employees,advanced engineers and senior technicians are up to 80 people. With advanced foreign technology supports and domestic 3G/4G device manufacturer in microwave pcb field which lead our experienced hi-frequencey researching team to one step ahead of the line of printed circuit board business,we are hornored to obtain sound reputations over our wolrdwide customers on the basis of fine qulity,prompt delivery,satisfied after sales service for may years and we assure our customers that we will return the favors with more and more superior products in the near future. Company spirit:Customer first,openness basing on sincerity. Comapny culture:Improve employees quality with on the job training. Quality policy:Honesty,superior quality,high efficiency. Company tenet: Provide customers with satisfactory products and service is our eternal tenet. Specification:Files:Gerber,protel,powerpcb,Autocad,etc.Material:FR-1,FR-4,CEM-1,CEM-3,HI-TG,AluminumLayer count:1-24 layersMax.Panel Size:450*1500mmBoard Thickness:0.2-5mmMin. Core Thickness:0.075mmCu Thickness:12-140umMin. Drill Size:0.2mmMax. Aspect Ratio: 8:1Min. Trace Width: 0.1mmMin line spacing:0.075mmMin. SMT/QFP Pitch:0.4mm Parameter:No. of LayerUp to 40 layersMaterialFR-4 (Tg≤210, Halogen Free, High Frequency), FR-4 High TgRCC, BT, PEFE, TEFLON, TACONIC, ARLON, High Frequency RogersCEM-1, CEM-3, 22F, Metal Base/Ceramic Base/Aluminum BaseMin. Width/Spacing50um/50umCopper Thickness1/3~12oz (12~420um)Thickness0.1~6.0mm (0.004’’~0.240’’)Min. Hole SpacingPTH (Plated Through Hole)0.10mm (0.004’’)NPTH (Non Plated Through Hole)0.10mm (0.004’’)Surface FinishHASL, HASL Lead Free, OSP, ENIG, Immersion Tin, Immersion SilverNickel Plating, Flash Gold, Gold-Finger, Carbon, Sliver Grout, ENIG, Electroplated soft gold, Electroplated Hard Gold.Special Processing BoardCopper plate edge, Sink hole, Tear ink, FPCCompetitive Advantage:1) With UL,ROHS,ISO,IPC2).Lead time:3-10 working days3)Competitive price best quality4).Rich 20 years experience in High Tg Multilayer PCB . What Information customer need to provide for quotation ?1. PCB Gerber files ,protel,powerpcb,Autocad,etc.2. BOM list for PCB assembly.3. Send us your sample PCB or PCBA.4. OEM is acceptable. Contact Information:Karen-Sales DepartmentShenZhen Xinchenger Electronic Co.,LtdEmail:[email protected]:0755-26055813Fax:0755-26055946Skype:karen-xcepcb