BGA 10 Layer Multilayer Printed Circuit Board With Immerison Gold Finished Surface

BGA 10 layer multilayer printed circuit board with immerison gold finished surfaceQ:Are you Factory or Trade company?A:We are factory manufacturer,welcome to visit our factory.Q:What kind of PCB file format can you accept for production?A:Gerber, PROTEL 99SE, PROTEL DXP, POWER PCBQ:Can you accept copy board?A:Yes,if you have pcb sample,can send to us,not only for PCB board,but also for PCBA,we can accept copy boardQ:How about your factory production capacity?A:FR4:2000000Sqms   High Frequency board:10000Sqms The main parameters of the substrate (Copper-Clad Laminate copper clad substrate) (in KB-6160 (the most commonly used FR-4 plate), for example)Yellow and white core plate divided core material, usually white core material;Sheet Size: 36 "* 48", 40 "* 48", 42 "* 48", 37 "* 49", 41 "* 49", 43 "* 49";Thickness: 0.10mm, 0.10MM behind by increments, usually the thickest of 3.20mm, 0.30mm or less can do multilayer core board, 0.60MM surface treatment can not do the following HAL, complete the following press thickness 1.00mm thickness the thickness of ± 0.10,1.00mm by more than ± 10%;Sheet copper thickness: 1 / 3OZ-12um, 1 / 2OZ-17.5um, 1OZ-35um, 2OZ-70um, 3OZ-105um, etc;TG value: glass transition temperature, the material begins to be interpreted as a softening point of the glass as the temperature in the molten state. Normal TG (≤140 ℃), the TG (150 ℃), high TG (≥170 ℃)CTI Definition: comparative tracking index; divided into six grades: 1 (CTI≥600V), 2 (600V> CTI≥400V), 3 (400V> CTI≥250V), 4 (249V> CTI≥175V), 5 ( 175V> CTI≥100V), 6 (100V> CTI≥0V);Dielectric constant (Er): general value 4.2-4.5;Thermal decomposition temperature (TD): typ. 305 ℃; PP presentation 1. Full name: epoxy fiberglass cloth prepreg, the English name: PrePreg; 2,.the role: between insulating layers and plays the role of an adhesive (plywood will be used); 3.size and thickness: a, common: 1080 (3.0mil ± 0.3), 2116 (4.5mil ± 0.5), 7628 (7.3mil ± 0.7); b, is not commonly used: 106,3313,1080L, 1080M, 1080H, 2116L , 2116M, 2116H, 1506,7628L, 7628M, 7628H, 7630; 4.only the general nip between the structural layer and a layer of PP, if exceeded, the need to improve the unit price quote;  The full name of Ball BGA Grid Array (BGA package), which is produced at the bottom of the ball array package substrate as the circuit I / O terminals and the printed circuit board (PCB) interconnected. Devices using the technology package is a surface mount device.  BGA package (Ball Grid Array Package) of I / O terminals are round or columnar pad matrix form distributed in the following packaging advantages of BGA technology is the I / O pin count, although increased, but did not pitch Save small but increased, thereby improving the assembly yield; although it increases the power consumption, but can be controlled collapse chip BGA welding method, which can improve its electric properties; thickness and weight than prior art encapsulation decreased ; reduce parasitics, the signal propagation delay is small, the frequency of use greatly increased; coplanar welding assembly is available, and high reliability.  Company spirit:Customer first,openness basing on sincerity. Comapny culture:Improve employees quality with on the job training. Quality policy:Honesty,superior quality,high efficiency. Company tenet: Provide customers with satisfactory products and service is our eternal tenet.   Model Number:XCEPCB0020   Shipping port:ShenZhen/HongKong          Place of origin:GuangDong,China    Delivery Time:3-10 Working Days  Production capacity:FR4:2000000Sqms   High Frequency board:10000SqmsPrice Terms:FOBMinimum Order Quantity:1pcPayment terms:TT,Paypal,Western UnionCertification:CE,ROHS,FCC,ISO9008,SGS,ULMaterial:FR4Soldermask:GreenMolde Number:xcepcb0020Silkscreen:WhiteLayer:10Panel Size:135*135mmBoard Thickness:1.6mmPackage Details:Inner:Vacuum-packed     Bubble bag     With Foam Outer:Carton BoxMin Line Space:4MilMin Line Width:4MilMin Hole Size:10MilFinished Surface:ENIGSpecial requirement:BGAResin HoleProvide Slice reportFinished Copper:1ozDelivery Time：8 DaysSpecification:FR-4 material is a fire code rating, represents a material specification is meant a resin material through the combustion state must be self-extinguishing, it is not a material name, but a material grade. So now FR-4 grade material is typically used in circuit boards, there are many species, but most are based on the so-called four-function (Tera-Function) plus epoxy filler (Filler) and glass fiber made composite materials.  Parameter:oItemData1Layer:1 to 24 layers2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers3Board thickness:0.20mm to 3.4mm4Copper thickness:0.5 OZ to 4 OZ5Copper thickness in hole:>25.0 um (>1mil)6Max. Board Size: (580mm×1200mm)7Min. Drilled Hole Size:4mil(0.1mm)8Min. Line Width:3mil (0.075mm)9Min. Line Spacing:3mil (0.075mm)10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold platingParameter:No. of LayerUp to 40 layersMaterialFR-4 (Tg≤210, Halogen Free, High Frequency), FR-4 High TgRCC, BT, PEFE, TEFLON, TACONIC, ARLON, High Frequency RogersCEM-1, CEM-3, 22F, Metal Base/Ceramic Base/Aluminum BaseMin. Width/Spacing50um/50umCopper Thickness1/3~12oz (12~420um)Thickness0.1~6.0mm (0.004’’~0.240’’)Min. Hole SpacingPTH (Plated Through Hole)0.10mm (0.004’’)NPTH (Non Plated Through Hole)0.10mm (0.004’’)Surface FinishHASL, HASL Lead Free, OSP, ENIG, Immersion Tin, Immersion SilverNickel Plating, Flash Gold, Gold-Finger, Carbon, Sliver Grout, ENIG, Electroplated soft gold, Electroplated Hard Gold.Special Processing BoardCopper plate edge, Sink hole, Tear ink, FPCCompetitive Advantage:1) With UL,ROHS,ISO,IPC2).Lead time:3-10 working days3)Competitive price best quality4).Rich 20 years experience in High Tg Multilayer PCB .  What Information customer need to provide for quotation ?1. PCB Gerber files ,protel,powerpcb,Autocad,etc.2. BOM list for PCB assembly.3. Send us your sample PCB or PCBA.4. OEM is acceptable. Contact Information:Karen-Sales DepartmentShenZhen Xinchenger Electronic Co.,LtdEmail:[email protected]:0755-26055813Fax:0755-26055946Skype:karen-xcepcb