16 Multilayer Metal Hole PCB Board With 8mil Min Line Width In Green Soldermask

  16 multilayer metal hole PCB board with 8mil min line width in green soldermask pp sheet is a prepreg (Prepreg is Pre-pregnant abbreviation),Website:http://www.xce-pcb.com, is a synthetic resin with the carrier sheet adhesive material. A. resin - is a thermosetting material for polymers, currently used as an epoxy resin. It has three life cycle to meet the requirements of the platen: A-Stage: brominated Bisphenol + epichlorohydrin liquid epoxy resin for the A-Stage, also known as varnish (Varnish). B-Stage: with glass fiber sizes in A-stage resin, after hot air or infrared drying, partial polymerization, into a solid film, called B-Stage. BGA stands for Ball Grid Array (PCB ball grid array structure), it is a large, pin package assembly, four pin QFP and similar, are using SMT solder paste to the circuit board is connected. Their differences are listed in the surrounding "space was the" single-row pin, such as gull wing room to move, room to move flat or retracted abdomen and foot end of the J-; changed to the bottom belly full array or an array of local, the adoption of a two dimensional area of the solder ball pinout, as the chip package on the circuit board solder interconnection tools. It has an area of less packaging, increased functionality, increased pin count, high reliability, good electrical properties, low overall cost. The outer line of the BGA production:BGA can refer to specifications, design pad size corresponding to the position of a customer to make a standard design BGA BGA array, and then as its benchmarks to be corrected under the BGA and BGA vias were being shot, to be filmed after the original is not shoot before the backup check the level of contrast before and after being shot effect, if BGA pad around large deviations, can not only beat BGA position over the next hole.  Model Number:XCEPCB0016   Shipping port:ShenZhen/HongKong          Place of origin:GuangDong,China    Delivery Time:3-10 Working Days  Production capacity:FR4:2000000Sqms   High Frequency board:10000SqmsPrice Terms:FOBMinimum Order Quantity:1pcPayment terms:TT,Paypal,Western UnionCertification:CE,ROHS,FCC,ISO9008,SGS,UL Material:FR4Soldermask:GreenMolde Number:xcepcb0016Silkscreen:WhiteLayer:16Panel Size:300*205mm/5pcsBoard Thickness:1.6mmPackage Details:Inner:Vacuum-packed     Bubble bag     With Foam Outer:Carton BoxMin Line Space:8MilMin Line Width:8MilMin Hole Size:18MilFinished Surface:ENIGSpecial requirement:BGAPrepregProvide Slice reportFinished Copper:1ozDelivery Time：8 DaysShenzhen Xinchenger Electronics was a leading manufacturer of high frequency and high difficult pcb circuit board for many years in shenzhen.We have newest pcb machine like laser drill machine,can do min2mil line space and width for you. With these top technology,we can meet all your requirements,such as 24 hours quick sample service,rogers&fr4 mixed compression,4-28 multilayer lamination,crossed blind buried vias hole and so on.Any inquiry can feel free to send us to check if we are able to manufacture your boards.We have professional engineer with more than 10 years pcb working experience can understand all your detail requirements whatever Chinese or English.  Via Hole ", ie, vias, refers to a multilayer circuit board only as a hole between the layers conductive interconnect applications, generally no longer used for welding parts of the foot insert Such holes through the" Shen copper "step in the hole plated with a layer of copper for conductivity. These vias penetrating the entire board "all through vias" (Through Via Hole), have turned to the board only without all through "blind vias" (Blind Via Hole), there is no contact with the plate surface Tong was buried in the inside of the plate, "buried through holes" (buried Via hole) and the like. These complex partial vias is sequentially continuous legal pressure (Sequential Lamination) produced complete. This term is also often referred to as "Via". The main parameters of the substrate (Copper-Clad Laminate copper clad substrate) (in KB-6160 (the most commonly used FR-4 plate), for example)Yellow and white core plate divided core material, usually white core material;Sheet Size: 36 "* 48", 40 "* 48", 42 "* 48", 37 "* 49", 41 "* 49", 43 "* 49";Thickness: 0.10mm, 0.10MM behind by increments, usually the thickest of 3.20mm, 0.30mm or less can do multilayer core board, 0.60MM surface treatment can not do the following HAL, complete the following press thickness 1.00mm thickness the thickness of ± 0.10,1.00mm by more than ± 10%;Sheet copper thickness: 1 / 3OZ-12um, 1 / 2OZ-17.5um, 1OZ-35um, 2OZ-70um, 3OZ-105um, etc;TG value: glass transition temperature, the material begins to be interpreted as a softening point of the glass as the temperature in the molten state. Normal TG (≤140 ℃), the TG (150 ℃), high TG (≥170 ℃)CTI Definition: comparative tracking index; divided into six grades: 1 (CTI≥600V), 2 (600V> CTI≥400V), 3 (400V> CTI≥250V), 4 (249V> CTI≥175V), 5 ( 175V> CTI≥100V), 6 (100V> CTI≥0V);Dielectric constant (Er): general value 4.2-4.5;Thermal decomposition temperature (TD): typ. 305 ℃;  Parameter:Layer No.1-16Min board thickness2 layer 0.2mm4 layer 0.4mm6 layer 0.6mm8 layer 0.8mm10 layer 1.0mmMax panel size508*610mmBoard thickness tolerance　　T≥0.8mm±8%,T＜0.8mm±5%Wall hole copper thickness　　＞0.025mm(1mil)Finished hole0.2mm-6.3mmMin line width4mil/4mil(0.1/0.1mm)Min bonding pad space0.1mm(4mil)PTH aperture tolerance±0.075mm(3mil)NPTH aperture tolerance±0.05mm(2mil)Hole site deviation±0.05mm(2mil)Profile tolerance±0.10mm(4mil)Board bend&warp≤0.7%Insulation resistance＞1012ΩnormalThrough-hole resistance＜300ΩnormalElectric strength＞1.3kv/mmCurrent breakdown10APeel strength1.4N/mmSoldmask regidity＞6HThermal stress288℃20SecTesting voltage50-300vMin buried blind via0.2mm(8mil)Outer cooper thickness1oz-5ozInner cooper thickness1/2 oz-4ozAspect ratio8:1SMT min green oil width0.08mmMin green oil open window0.05mmInsulation layer thickness0.075mm-5mmAperture0.2mm-0.6mmCompetitive Advantage:1) With UL,ROHS,ISO,IPC2).Lead time:3-10 working days3)Competitive price best quality4).Rich 20 years experience in High Tg Multilayer PCB . What Information customer need to provide for quotation ?1. PCB Gerber files ,protel,powerpcb,Autocad,etc.2. BOM list for PCB assembly.3. Send us your sample PCB or PCBA.4. OEM is acceptable. Contact Information:Karen-Sales DepartmentShenZhen Xinchenger Electronic Co.,LtdEmail:[email protected]:0755-26055813Fax:0755-26055946Skype:karen-xcepcb